SPEC - Semiconductor Process Equipment Corp.

We specialize in integrated wet bench systems for any cleanroom environment.

Wet Benches - Silicon Wafers 2" to 300mm - Specialized Substrates 300mm x 300mm and up to 700mm diameter - Polysilicon Chunk Cleaning - Quartz Tubes - Crucible Filaments - Disk Drive Media and Heads - Bump Packaging - Electroless and Electroplating - UBM Under Bump Metallization - Wafer Processing - Etch - Solvent - Diffusion - Prediffusion - Oxide - Nitride - Resist - Photo resist - Biotech - DNA Arrays - Subdermal Sensors - PLC Programmable Logic Controllers - Quartz Tanks - Linear Transfer - Rotary Transfer - Chemical Dispense Systems - Waste Collection Systems - Water Heaters - Storage Cabinets - Carts

www.team-spec.com
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Manufacturing Capability: Manufacturing facility located in Southern California, approximately thirty (30) miles north of the Hollywood Burbank Airport. Facilities include Metal Fabrication equipment, full CNC Machine Shop, Plastic Fabrication equipment, including 3 Axis 5' x 10' machining centers, Thermal Forming and Welding Equipment. Final Assembly and Test in a Class 1000 Clean Room , equipped with D.I. Water System and CDA. 

Clean Room Assembly: Final Test and Assembly of our Clean Room Products is carried out in our Class 1000 Clean Room. Equipment is thoroughly cleaned with a mixture of IPA and DI Water prior to being triple packaged for shipment.

Quality Control: Policies and Procedures in place for incoming material inspection, pre-assembly test of critical components, spark test of plastic weldments, full liquid tests of all Plenums, High Pressure CDA Testing of all Manifolds, followed by complete Wet Test and Operational Test of all Systems Components. Final Engineering review of project for Customer Specification Compliance.

Inventory - Critical Path and Control: Standard Operation Procedures for identifying all long lead items and specialized components needed for engineering test. Components are scheduled and ordered based on actual need date as assemblies fall into production schedule. Critical materials and components are allocated and kitted on Clean Room Carts dedicated to Special Projects.

Airflow Considerations: The majority of SPEC's projects involve equipment that will reside in a Clean Room. Every station has an impact on the Clean Room Environment and SPEC designs its equipment to minimize that impact. Different station designs are proposed dependent upon the Customers desire for clean Laminar Air at the station, reduced exhaust consumption, and specific safety requirements.

Process Compatibility / Materials: The material of construction used in Process Stations are usually chosen in this industry based on Chemical Compatibility. SPEC then evaluates materials for Total Process Compatibility. It is not enough for the material not to be degraded by the chemical, the material and the chemical combined must not degrade the process.

Production Requirements - Thru-put, with Specific Needs: Varying from Research and Laboratory Equipment to Highly Automated Production Stations, part of the design task is to establish the Customers needs for now and the foreseeable future, relative to capacity and thru-put. SPEC has designed and implemented several types of process automation, each to fit a particular need. The "AT" System for high thru-put multi tank processes that transfer for concurrent multi recipe processes offered with both passive and active end effectors the"ALT, Active" Systems incorporate multi axis robotic arm assemblies on a linear track for more complex movement capabilities like SRD loading and wafer transfer system interfaces.

Safety Requirements: SPEC understands that different customers have different specific safety requirements. The design approach is to meet these requirements with methods that still allow complete functionality of the equipment. In the absence of specifications from the Customer, Systems are designed to meet NEC, OSHA, NFPC, and ANSI Standards.

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