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Automatic Wet Benches for RCA Cleaning

The RCA cleaning process is proven to provide superior removal of contamination from a variety of surfaces including silicon, sapphire, quartz wafer and plates. 

  • Automatic sequential processing through solutions of NH4OH with H2O2 followed by HCl with H2O2 remove organics and trace metals.
  • Acoustic streaming megasonic energy aids in removing sub-micron particles. 
  • Additional pre-cleaning steps including sulfuric-peroxide or SPM for photoresist or post-ash removal a well as dilute HF to remove native oxide are typical optional featuress.

 

 

 

Call for more information... 661-257-0934

 

Footprint ranges start at 72” X 96” as shown 78” X 230"

As shown this unit provides the final wet process and dry for a major wafer re-claimer.  Following physical removal of the as received surface, wafers require final cleaning, particle removal and pristine drying while respecting a tight edge-exclusion. 

Surface tension gradient (Marangoni-effect) drying is available. Internal ULPA filtration with automatic airflow adjustment is combined with zoned-airflow to protect wafers.

Modular design system is available in a range of materials to match end-user process and facilities needs.   The combination of materials included mirror-finish stainless steel, FM-4910 certified PVC and ECTFE modules to fit both the budget and chemical compatibility requirements.  SPEC’s exclusive design utilizes fully encapsulated steel frames with modular electrical and piping. 

These elements allow separation for delivery to global locations while nearly all of the hardware remains connected.  Rapid reassembly and re-start is assured, speeding qualification and ramp of production. 

Sulfuric Strip